Thanks for clarifying that.5ft24 wrote: ↑21 Nov 2022, 13:30The board is multi-layer. Scratching through more than just the insulation can break internal traces that the Via intersects with. Not sure if Xemodex can fix that...NuovoRecord wrote: ↑21 Nov 2022, 11:31Thanks. This is a difficult learning experience. I should have first tried with a junkyard CEM. This will probably be sent to Xemodex, and they can connect from the top if necessary.oscilloscope wrote: ↑21 Nov 2022, 10:46
Omfg!
I was under the impression the brick style cem which that looks like one. The cracker is not able to work on it (yet)
Now it looks like you have ablitarated the via's!! Now you maybe able to still clone this module. You could try and use usbjtag which can connect to these via the microprocessor. , what you will have to do is connect from the top apposed to the vias on the back side. Then you will probably have to source check if IOT can decode the code via dump or Possibly SMOK.
One thing that confuses me: I don't see any traces on the underside of the board that the (now obliterated) pads connected to. It seemed they were just there to help secure the main surface mount processor. In which case, the pads lifting / vias being damaged wouldn't seem to have any effect (as long as they weren't shorting to ground, which they don't seem to be). Is this wrong?
I'm going to order some better soldering tools and try to rescue this myself before paying big $ to Xemodex. I'll document as much as I can here.






